Toyota – System Impact Assessment of new chip packaging technologies


Toyota Europe was looking to better understand the trends in chip packaging and the potential impact on the system design of cars.

The project was led by Frost & Sullivan who chose Mindsheet to undertake the assignment

System Impact Assessment of new chip packaging technologies
System Impact Assessment of new chip packaging technologies

In particular, Mindsheet’s role was:

  • Research chip packaging global IP
  • Trends in chip packaging and interconnect
  • Understand the impact on car design at the system level
Patent Analysis by Institution
Patent Analysis by Institution, Mindsheet Toyota assignment 2005

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